High Density Interconnect Market is Projected to Grow at 9.2% CAGR from 2022 to 2032 | Report by FMI

The United States high density interconnect market is set to create an absolute $ growth of US$ 5.2 billion till 2032.

The high density interconnect market is expected to increase significantly in the future years. According to latest market research, market revenues are expected to reach US$ 15 billion in 2022 and US$ 36 billion by 2032. It is expected to increase at a CAGR of 9.2% between 2022 and 2032.

The increasing demand for electronic gadgets in numerous areas, including as telecommunications, consumer electronics, and vehicles, is driving market expansion.

The growing usage of touch-screen gadgets, mobile phones, laptop computers, and digital cameras is fueling the market’s expansion. The market is expected to grow further as electronic gadgets become more compact and performance-intensive.

The medical sector is also propelling the market forward. Rising medical costs are driving increased demand for high-density interconnects in medical devices and equipment.

Another significant sector driving market expansion is the aerospace industry, which is expanding manufacturing rates for electronic aircraft parts and components.

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Other factors influencing market growth include widespread use of enhanced safety systems, the emerging trend of autonomous driving, higher sales of smart devices and gaming consoles, rising disposable income levels, and active research and development (R&D) initiatives. The market is likely to expand further as firms invest in R&D to develop new and creative goods that match changing consumer needs.

The networking, 5G, data center, automotive/LIDAR, aerospace, and military industries will all see significant need for innovative high density connectivity technologies.

Finally, the high density interconnect market is predicted to rise significantly in the future years, owing to rising demand for compact, durable, and performance-intensive electronic gadgets across many consumer sectors.

As the market expands, companies will need to engage in R&D to develop new and innovative goods that meet changing consumer needs.

Key Takeaways from Emergency Spill Response Market Study:

• The global high density interconnect market exhibited a moderate CAGR of around 12.0% during the historical period.
• North America high density interconnect market is projected to be worth US$ 8.9 billion in 2032.
• The United States high density interconnect market is set to create an absolute $ growth of US$ 5.2 billion till 2032.
• Based on type, the 10+ Layers HDI segment is anticipated to accelerate at a CAGR of 9.1% from 2022 to 2032.
• Based on application, the wearable devices segment witnessed prominent growth at a CAGR of 11.6% from 2017 to 2021 and is projected to grow at 9.0% CAGR by 2032.

“The upsurge in hi-tech digital products has given rise to enhanced consumerism in electronic devices. This has paved the way for technology manufacturers to yield benefits from the global high density interconnect market, especially in the printed circuit boards, and wearable segments.” – Says a lead analyst.

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Competitive Landscape

The top market players are constantly thinking of novel ways to deliver high-quality goods, as well as to patent their innovations to broaden their product lines. The players, who presently have a tiny market share, are constantly working to increase their market share in high density interconnect.

For instance,

• In October 2021, during a circuit and packaging expo in Korea, Samsung Electro-Mechanics, a South Korean company, displays semiconductor substrate technology.

Samsung electro-mechanics concentrated on displaying high-performance, high-density, and ultra-slim semiconductor package substrates this time. A semiconductor package substrate connects a mainboard and a highly integrated chip to carry electrical signals and electricity (circuit board).

Advanced processes that can increase the number of layers, implement microcircuits, establish granular inter-layer uniformity, and make products thin to minimize set thickness are needed for substrates for high-performance semiconductors used in 5G, AI, and vehicles.

Get More Exclusive Insights into High Density Interconnect Market Study

Future Market Insights, in its new offering, presents an unbiased analysis of the high density interconnect market, presenting historical market data (2018 to 2022) and forecast statistics for the period from 2022 to 2032.

The study reveals extensive growth in the high density interconnect market. It is categorized by product (4-6 Layers HDI, 8-10 Layers HDI and 10+ Layers HDI), by application (automotive electronics, computer and display, communication devices, and equipment, BFSI, connected devices, and wearable devices), and by region (North America, Latin America, Europe, Asia Pacific and the Middle East and Africa).

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High Density Interconnect Market Outlook by Category

By Product:

• 4-6 Layers high density interconnect
• 8-10 Layers high density interconnect
• 10+ Layers high density interconnect

By Application:

• Automotive Electronics
• Computer and Display
• Communication Devices and Equipment
• BFSI
• Connected Devices
• Wearable Devices

By Region:

• North America
• Latin America
• Europe
• Asia Pacific
• Middle East and Africa