System on Package Market: Consumer Needs to Drive Advances in Power Efficiency

System On Package Market deals with technology that places an entire system with computing, communications, and consumer functions all in a single chip.

The System on Package Market (SOP) deals with the development, manufacture and distribution of the SOP system and the latest SOC designs. A SOC chip (System on Chip) can be described as an integrated circuit that contains all the sub-systems inside a computer on a single chip.

The System on Package Market has witnessed a huge rise in demand for electronic gadgets which are extremely power efficient. Other factors driving the demand for SOC designs and SOC technology is falling costs of integrated circuits and a rise in requirement for superior graphics as well as multi-core capabilities.

Right now, the SOC chips designed by the System on Package Market are being utilized in a wide range electronic devices like smartphones, automotive electronics, communication equipment, etc. The recent improvements in SOC technology as well as inevitable leaps predicted by Moore’s Law are also fuelling the development of radical new SOC systems.

Scope & Regional Forecast of the System on Package Market

The SOP systems produced by the System on Package Market enable various benefit like lower cost of production, more power efficient and vastly superior performance. This type of electronic packaging reduces the time for interconnection and minimizes heat generation by squeezing all computer components on to a single chip.

Over the last few years, the System on Package Market has witnessed the consumer electronics segment transform into the largest market for this type of electronic packaging. This growth is due to the ubiquity of tablets, smartwatches, etc. SOC manufacturers have also been busy developing radically different system on chip designs due to consumer demand for more power efficient devices.

Right now, the System on Package Market is dominated by demand originating from the region of Asia-Pacific. This is set to continue as a huge population within this region are set to adopt consumer electronics on a rapid basis. The rise in disposable income has also boosted usage rates and rural penetration has led to a spike in internet users. Hence, the gradual exposure to modern technology is set to result in the growing of connected devices.

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Segmentations & Key Players involved in the System on Package Market

According to IndustryARC findings, the System on Package Market can be broken down into various segmentations on the basis of –

Technology Elements: Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring, Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and Advanced Microchannel Cooling.

Application: Consumer Electronics and Wireless Communication.

Geographical Location: Americas, Europe, Asia-Pacific and RoW.

Some of the key players involved in the System on Package Market according to IndustryARC are as follows:

·         Hollysys Automation Technologies Ltd

·         Thomas & Betts Corporation

·         Thales Group

·         R. STAHL, Inc.

·         NHP Electrical Engineering Products

·         E2S Warning Signals

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System On Package Market deals with technology that places an entire system with computing, communications, and consumer functions all in a single chip.

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Dec 19, 2016